Imaging and Resist Technologies for the Micromachining Industry

نویسنده

  • David Craven
چکیده

The major steps in the pattern transfer process will be identified and used to explain the individual aspects of the challenges involved with high aspect ratio and high topography. The structural perspective of micromachined devices will then be introduced as a foundation for identifying the high aspect ratio and high topography challenges. These two key photolithography challenges will then be discussed.

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تاریخ انتشار 1997